Patent · US Expired

Vertical type semiconductor device and method for producing the same

US5250449A · kind A · utility

31Cited by
6References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 30, 1991
Grant dateOct 5, 1993
Priority date
Expiry dateSep 30, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S148/126

Abstract

The present invention has as an object the provision of a vertical type semiconductor device whereby miniaturization and lowered ON resistance of the cell can be achieved without impairing the functioning of the device. The line width of the gate electrode is made smaller to meet the demand for miniaturization of the cell, but the distance between the channel regions diffused into the portions below the gate at the time of double diffusion is kept to be virtually equal to that in the device of larger cell size having a low J.sub.FET resistance component. Here, the reason for making the line width of the gate electrode smaller is for securing an area for the source contact. The point is that, while the width of the gate electrode is set to be smaller, the mask members as the mask for double diffusion, having the width allowing the source region to diffuse to the portion under the gate, are attached to the side walls of the gate electrode. Thereby, miniaturization and lowered ON resistance of the cell can be achieved without impairing the functioning of the device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.