Method of making micromechanical components

US5254209A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Steffen Schmidt · Dresden, DE
• Hans-Peter Trah · Reutlingen, DE
• Franz Riedinger · Horizontina, BR

Key dates

• Filing date: Oct 8, 1992
• Grant date: Oct 19, 1993
• Expiry date: Oct 8, 2012

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F9/7084
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method of making micromechanical structures from silicon involves cutting a monocrystalline silicon wafer. The orientation of the crystal structure relative to the flat of the wafer is first determined, and this information is taken into account in the subsequent structuring steps.