Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5258648A · kind A · utility
296Cited by
5References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 27, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Nov 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/912
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite flip chip semiconductor device (10) permits burn-in testing and rework to be performed on the device while also enhancing electrical, thermal, and mechanical device performance. The device includes a semiconductor die (12) having a plurality of bonding pads (14). Also included in the composite device is an interposer (22) having a first surface with a plurality of traces (26). A plurality of vias (24) extend from the first surface of the interposer (22) to a second surface. The semiconductor die (12) is electrically coupled to the plurality of vias of the interposer which in turn is to be coupled to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.