Simplified method for direct electroplating of dielectric substrates
US5262042A · kind A · utility
5Cited by
13References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 12, 1991 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Dec 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved methods for electroplating non-conducting substrates are disclosed utilizing aqueous saline adhesion promoter solutions and rinse solutions to enhance the surface deposition of colloidal metal activating catalysts to form conducting layers capable of direct electroplating. One variation of the process recycles excess activating catalyst into the aqueous saline adhesion promoter to eliminate waste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.