Circuit board and sealing structure and methods for manufacturing the same
US5262614A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 1991 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | May 31, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board is manufactured by a method having the steps of depositing a metal pattern on a ceramic board, depositing a thin layer of a high polymer material on the ceramic board formed with the metal pattern, depositing a protective layer of a high polymer material on the thin layer of the high polymer material, and directing a laser beam toward and onto the protective layer and the thin layer deposited on a plating region of the metal pattern and a cutting region of the ceramic board thereby selectively removing part of those layers. The laser beam has a wavelength range of from 150 nm to 400 nm, an energy density range of from 0.5 J/cm.sup.2 to 5.0 J/cm.sup.2, and a pulse width range of from 100 ps to 1 .mu.s.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.