Wirebond pin-plastic header combination and methods of making and using the same
US5263880A · kind A · utility
46Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1992 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Jul 17, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a wirebond pin having a star-shaped anchor, collar and paddle. The collar prevents passivation material, used to make a sealed semiconductor device, from leaking out of the package. The collar also helps to eliminate the resonant vibration of the pin during ultrasonic wirebonding at the paddle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.