Conformal wafer chuck for plasma processing having a non-planar surface
US5266527A · kind A · utility
5Cited by
1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 1991 |
| Grant date | Nov 30, 1993 |
| Priority date | — |
| Expiry date | Sep 17, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a semiconductor wafer using a wafer chuck having a first end with a non-planar surface, the non-planar surface shaped such that a wafer supported at a plurality of points about its periphery will have a uniform pressure between its surface and the non-planar surface, and pressing a surface of the wafer against the non-planar surface of the wafer chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.