Confined water fixture for holding wafers undergoing chemical-mechanical polishing
US5267418A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1992 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | May 27, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q3/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer polishing fixture is disclosed containing a first liquid film confined by a non-porous but flexible enclosure for distributing evenly the applied polishing forces across the surface of a wafer supported by the confined liquid. The fixture comprises a flexible, non-porous template with a pocket for receiving a wafer to be polished. A washer is placed between a carrier and the template pocket. A film of water fills the bottom of the pocket and is confined with the aid of the washer and by an overlying porous pad extending across the pocket and having a non-porous sheath facing the liquid. A second liquid film saturates and covers the upper surface of the pad. The wafer to be polished floats upon the second liquid film within the pocket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.