Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition
US5268255A · kind A · utility
9Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/119
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A printed circuit board has a resist layer made from a photo-setting resist composition containing: PA0 (A) a polyfunctional unsaturated compound which is solid at room temperature, PA0 (B) a polyfunctional unsaturated compound which is liquid at room temperature, PA0 (C) a photopolymerization initiator, PA0 (D) an epoxy resin, PA0 (E) at least one member selected from the group consisting of: PA1 (i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and PA1 (ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.