Method for separating bonded substrates, in particular disassembling a liquid crystal display device
US5269868A · kind A · utility
17Cited by
11References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1992 |
| Grant date | Dec 14, 1993 |
| Priority date | — |
| Expiry date | Nov 12, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for separating bonded substrates which are prepared by facing a plurality of substrates and bonding the substrates by an adhesive features irradiating an energy beam on the bonding portions of the bonded substrates from above one of the bonded substrates to separate the one substrate and the other substrate. The energy beam has the property of being transmitted through the one substrate and of being absorbed into the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.