Positive working photoresist composition containing mid or near UV radiation sensitive quinone diazide and sulfonic acid ester of imide or oxime which does not absorb mid or near UV radiation
US5273856A · kind A · utility
4Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Positive photoresist compositions which comprise an alkali soluble resin material, a diazoquinone dissolution inhibitor which decompose on exposure to mid and near UV radiation, and a sulfonic acid ester of an imide or oxime which does not absorb such mid or near UV radiation. Resist images of high contrast are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.