Patent · US Expired

Vapor phase growth method of forming film in process of manufacturing semiconductor device

US5273933A · kind A · utility

29Cited by
1References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 23, 1992
Grant dateDec 28, 1993
Priority date
Expiry dateJul 23, 2012

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/925
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In a process of manufacturing a short-wavelength-light emitting element, n- and p-type GaInAlN films are formed on a substrate made of SiC, using an MOCVD method. (CH.sub.3).sub.3 SiN.sub.3 is used as raw material for nitrogen. The films are grown at a relatively low temperature and the amount of nitrogen doped in the films is increased.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.