Method for polishing semiconductor wafer edges
US5274959A · kind A · utility
12Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1992 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Dec 11, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.