Method and apparatus for detecting wire bond pull test failure modes
US5275058A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1992 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Oct 30, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample having first and second bond foots affixed to respective first and second support pads. The method and apparatus monitors the voltage levels of first and second electrically conductive probes. The first probe has a primary lead in electrical contact with the first support pad and a secondary lead in electrical contact with the first bond foot. Similarly, the second electrically conductive probe has a primary lead in electrical contact with the second support pad and a secondary lead in electrical contact with the second bond foot. Voltage detection circuitry is provided in electrical contact with the first and second probes for detecting the voltage level at each of the respective primary and secondary leads to generate the respective corresponding output signals. Comparator circuitry is further provided in electrical contact with the voltage detection circuitry for receiving and comparing each of the output signals to a selected reference value and generating a supplemental output signal indicating the location of b…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.