Cuong Pham
34Patents
12h-index
41Co-inventors
81Inventor score
Filing activity: Oct 30, 1992 → Jul 30, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7640658B1 | Methods for forming an anti-tamper pattern | Emerging Cross-Sectional Technologies | 71 | Expired |
| US7947911B1 | Anti-tamper mesh | Emerging Cross-Sectional Technologies | 71 | Active |
| US5579573A | Method for fabricating an undercoated chip electrically interconnected to a substrate | Emerging Cross-Sectional Technologies | 68 | Expired |
| US5427301A | Ultrasonic flip chip process and apparatus | Electricity | 43 | Expired |
| US7880248B1 | Destructor integrated circuit chip, interposer electronic device and methods | Emerging Cross-Sectional Technologies | 42 | Active |
| US5655700A | Ultrasonic flip chip bonding process and apparatus | Electricity | 32 | Expired |
| US6326241A | Solderless flip-chip assembly and method and material for same | Electricity | 31 | Expired |
| US7489013B1 | Destructor integrated circuit chip, interposer electronic device and methods | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5510721A | Method and adjustment for known good die testing using resilient conductive straps | Physics | 19 | Expired |
| US6381837B1 | Method for making an electronic circuit assembly | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6505665B1 | Method and apparatus for use in assembling electronic devices | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6251219A | Method and apparatus for use in assembling electronic devices | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6019271A | Method for ultrasonic bonding flexible circuits | Electricity | 11 | Expired |
| US5275058A | Method and apparatus for detecting wire bond pull test failure modes | Electricity | 11 | Expired |
| US5598096A | Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal | Electricity | 10 | Expired |
| US8005217B2 | Method and apparatus for configuring nodes in a wireless network | Electricity | 9 | Active |
| US5681663A | Heatspreader carrier strip | Emerging Cross-Sectional Technologies | 9 | Expired |
| US8399781B1 | Anti-tamper mesh | Emerging Cross-Sectional Technologies | 9 | Active |
| US5921460A | Method of soldering materials supported on low-melting substrates | Electricity | 8 | Expired |
| US8538019B2 | Method and apparatus for configuring nodes in a wireless network | Electricity | 7 | Active |
| US8240038B1 | Method for forming an anti-tamper mesh | Emerging Cross-Sectional Technologies | 7 | Active |
| US7705439B2 | Destructor integrated circuit chip, interposer electronic device and methods | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6126459A | Substrate and electrical connector assembly | Electricity | 3 | Expired |
| US6449839B1 | Electrical circuit board and a method for making the same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5899759A | Electrical connector for rigid circuit boards | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.