Patent · US Expired

Radial epitaxial reactor for multiple wafer growth

US5275686A · kind A · utility

3Cited by
6References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 25, 1991
Grant dateJan 4, 1994
Priority date
Expiry dateSep 25, 2011

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC30B25/14
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An improved gas distribution scheme for a multi-wafer radially injected convergent horizontal epitaxial reactor which includes two outer distribution rings, an outer injection ring, an annular susceptor, and a central exhaust tube. The converging path of the gas stream from the outer injection ring into the central exhaust tube compensates for depletion of the reactant gases along the substrate. The injector ring has a large number of evenly spaced diffuser orifices that allow the gas to expand into the growth chamber in a laminar flow pattern. The design is compact, includes the possibility of water cooling of the quartz during deposition, and allows for a resistive bakeout furnace which can be used to etch and clean the reaction chamber between runs.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.