Radial epitaxial reactor for multiple wafer growth
US5275686A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1991 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Sep 25, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved gas distribution scheme for a multi-wafer radially injected convergent horizontal epitaxial reactor which includes two outer distribution rings, an outer injection ring, an annular susceptor, and a central exhaust tube. The converging path of the gas stream from the outer injection ring into the central exhaust tube compensates for depletion of the reactant gases along the substrate. The injector ring has a large number of evenly spaced diffuser orifices that allow the gas to expand into the growth chamber in a laminar flow pattern. The design is compact, includes the possibility of water cooling of the quartz during deposition, and allows for a resistive bakeout furnace which can be used to etch and clean the reaction chamber between runs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.