Resin sealed semiconductor device having power source by-pass connecting line
US5276352A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1993 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Feb 22, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin sealed semiconductor device having: a semiconductor chip having an electric circuit therein and an elongated main connection line respectively formed thereon; a plurality of leads disposed near the chip; electrical connecting wires for electrically connecting together the chip and the leads; at least one by-pass connection line formed in correspondence with the main connection line; and by-pass connecting wires for electrically connecting the main connection line near at one end thereof to the by-pass connection line near at one end thereof, and electrically connecting the main connection line near at the other end thereof to the by-pass connection line near at the other end thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.