Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring system
US5277579A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 6, 1992 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Mar 6, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafers transferring method in the heat treatment apparatus of the vertical type comprising providing a boat loading/unloading chamber under a process tube, providing an elevator in the boat loading/unloading chamber, providing a wafer loading/unloading chamber communicated with the boat loading/unloading chamber, providing a robot in the wafer loading/unloading chamber, mounting a boat on the elevator, loading wafers one by one into the boat from the bottom to the top by the robot, while lowering the boat every pitch, heat-processing the wafers in the boat in the process tube, and unloading the wafers one by one from the boat from the top to the bottom by the robot, while lifting the boat every pitch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.