Eiichiro Takanabe
7Patents
7h-index
12Co-inventors
56Inventor score
Filing activity: Aug 17, 1989 → Apr 13, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5775889A | Heat treatment process for preventing slips in semiconductor wafers | Chemistry; Metallurgy | 369 | Expired |
| US5388944A | Vertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatus | Emerging Cross-Sectional Technologies | 78 | Expired |
| US5277579A | Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring system | Emerging Cross-Sectional Technologies | 52 | Expired |
| US5016567A | Apparatus for treatment using gas | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5030056A | Substrate transfer device | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6402848B1 | Single-substrate-treating apparatus for semiconductor processing system | Electricity | 15 | Expired |
| US5688116A | Heat treatment process | Mechanical Engineering; Lighting; Heating | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.