Reduced stress plastic package
US5278446A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1992 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Jul 6, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic package (10) with a heat sink (11, 27, 28, 32) has a stress relief wall (18, 21, 33) formed on its upper surface. A semiconductor die (12) is mounted on the heat sink (11, 27, 28, 32) such that the top of a semiconductor die (12) is below the level of the top of the wall (18, 21, 33), and the wall (18, 21, 33) absorbs stresses which otherwise would be applied to the semiconductor die (12). The package (10) is simple to fabricate and assemble, and provides a mold lock (23, 24, 31) which serves to hold the plastic material (13) tightly to the heat sink (11, 27, 28, 32). Extra die bond material (26) can be used to increase heat flow without compromising other characteristics of the package (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.