Stripping compositions comprising hydroxylamine and alkanolamine
US5279771A · kind A · utility
87Cited by
11References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1990 |
| Grant date | Jan 18, 1994 |
| Priority date | — |
| Expiry date | Nov 5, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02052
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A stripping composition for removing resists from substrates containing hydroxylamine and at least one alkanolamine is described. Optionally, one or more polar solvents can also be included in the stripping composition. The stripping composition is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.