EKC Technology, Inc.
89Patents
21Active
89Granted
56Portfolio score
Filing activity: Nov 23, 1981 → Oct 23, 2023 · 9 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5334332A | Cleaning compositions for removing etching residue and method of using | Electricity | 150 | Expired |
| US6117783A | Chemical mechanical polishing composition and process | Emerging Cross-Sectional Technologies | 142 | Expired |
| US5981454A | Post clean treatment composition comprising an organic acid and hydroxylamine | Chemistry; Metallurgy | 136 | Expired |
| US5279771A | Stripping compositions comprising hydroxylamine and alkanolamine | Electricity | 87 | Expired |
| US6156661A | Post clean treatment | Chemistry; Metallurgy | 84 | Expired |
| US4824763A | Triamine positive photoresist stripping composition and prebaking process | Emerging Cross-Sectional Technologies | 82 | Expired |
| US4395348A | Photoresist stripping composition and method | Chemistry; Metallurgy | 72 | Expired |
| US5911835A | Method of removing etching residue | Chemistry; Metallurgy | 59 | Expired |
| US5482566A | Method for removing etching residue using a hydroxylamine-containing composition | Electricity | 57 | Expired |
| US6313039A | Chemical mechanical polishing composition and process | Emerging Cross-Sectional Technologies | 54 | Expired |
| US6248704A | Compositions for cleaning organic and plasma etched residues for semiconductors devices | Chemistry; Metallurgy | 53 | Expired |
| US5891205A | Chemical mechanical polishing composition | Electricity | 51 | Expired |
| US5381807A | Method of stripping resists from substrates using hydroxylamine and alkanolamine | Electricity | 51 | Expired |
| US6235693A | Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices | Chemistry; Metallurgy | 49 | Expired |
| US6566276B2 | Method of making electronic materials | Electricity | 45 | Expired |
| US5399464A | Triamine positive photoresist stripping composition and post-ion implantation baking | Emerging Cross-Sectional Technologies | 40 | Expired |
| US6546939B1 | Post clean treatment | Chemistry; Metallurgy | 39 | Expired |
| US5672577A | Cleaning compositions for removing etching residue with hydroxylamine, alkanolamine, and chelating agent | Electricity | 39 | Expired |
| US6251150A | Slurry composition and method of chemical mechanical polishing using same | Chemistry; Metallurgy | 34 | Expired |
| US7361231B2 | System and method for mid-pressure dense phase gas and ultrasonic cleaning | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6458431B2 | Methods for the lithographic deposition of materials containing nanoparticles | Electricity | 32 | Expired |
| US6916772B2 | Sulfoxide pyrolid(in)one alkanolamine cleaner composition | Chemistry; Metallurgy | 32 | Expired |
| US6110881A | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials | Chemistry; Metallurgy | 30 | Expired |
| US6825156B2 | Semiconductor process residue removal composition and process | Chemistry; Metallurgy | 29 | Expired |
| US6417112B1 | Post etch cleaning composition and process for dual damascene system | Emerging Cross-Sectional Technologies | 29 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.