Method and apparatus for removing vapor from a pressurized sprayed liquid in the manufacture of semiconductor integrated circuits
US5279926A · kind A · utility
6Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1992 |
| Grant date | Jan 18, 1994 |
| Priority date | — |
| Expiry date | May 6, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Pressurized liquid solvent is dispensed on specific areas of a semiconductor wafer. A vented accumulator removes bubbles introduced by an upstream needle valve. The accumulator outlet leads directly to a dispensing tip, without further pressure drop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.