Process for making microcomponents integrated circuits
US5279988A · kind A · utility
Inventors
Key dates
| Filing date | Mar 31, 1992 |
| Grant date | Jan 18, 1994 |
| Priority date | — |
| Expiry date | Mar 31, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/702
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for fabricating discrete electrical microcomponents, such as microtransformers, microautotransformers and microinductors, on a semiconductor substrate in which two patterned layers of electrically conductive material are electrically connected through vias in two interposed layers of electrically insulating material to form electrically conductive coils around a magnetic core formed by a patterned layer of magnetic material interposed between the two insulating layers. Laminated magnetic cores may be formed by patterning multiple layers of magnetic material. The microcomponents can also be formed without magnetic cores and can be formed on insulating substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.