Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate
US5280193A · kind A · utility
Inventors
Key dates
| Filing date | May 4, 1992 |
| Grant date | Jan 18, 1994 |
| Priority date | — |
| Expiry date | May 4, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/403
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor multiple package module (10) on a PCB material substrate (18) is provided, wherein semiconductor dice are directly mounted onto the PCB material substrate (18) thereby eliminating a subsequent board mounting at the customer level. A plurality of semiconductor dice are mounted and electrically connected to a plurality of circuit traces (22) on the PCB material substrate (18) having a plurality of edge connectors (20). The plurality of circuit traces (22) has conductive paths to electrically interconnect the semiconductor dice to the edge connectors (20) and to each other. The semiconductor dice are directly overmolded on the PCB material substrate (18) with a molding compound to form individual semiconductor devices (12, 14, and 16) having separate package bodies. The individualized package bodies enable repair to the module by making removal of only nonfunctional semiconductor devices from the PCB material substrate (18) possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.