Fixture for backside wafer etching
US5280894A · kind A · utility
315Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1992 |
| Grant date | Jan 25, 1994 |
| Priority date | — |
| Expiry date | Sep 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fixture which includes a lower base for supporting and protecting the front surface of a semiconductor wafer and a clamp. The lower base has an upper end having a central surface portion recessed from a peripheral surface portion for supporting by means of an O ring the peripheral portion of the front surface of the wafer. The clamp rests on a peripheral portion of the back surface of the wafer with the remaining back surface exposed to the backside etching process. A pin and hole arrangement help align the clamp to the base. Holes in the base equalize pressure on both sides of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.