Patent · US Expired

Structure and method of making Alpha-Ta in thin films

US5281485A · kind A · utility

144Cited by
8References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 15, 1993
Grant dateJan 25, 1994
Priority date
Expiry dateJan 15, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31678
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention relates generally to a structure and a method of making Alpha-Ta films, and more particularly, to a structure and a method of making Alpha-Ta in thin films. A seed layer of Ta reactively sputtered in a nitrogen containing environment is grown on the substrate, and using this seed layer of Ta(N) layers of Alpha-Ta are then formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.