Polyoxyalklene compounds terminated with ketone groups for use as surfactants in alkanesulfonic acid based solder plating baths
US5282953A · kind A · utility
6Cited by
10References
25Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 28, 1993 |
| Grant date | Feb 1, 1994 |
| Priority date | — |
| Expiry date | Jun 28, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Baths and methods for the electroplating of tin, tin-lead, tin-antimony, and/or tin-bismuth are described. Specifically, electrodeposition solutions, based on alkanesulfonic acids, soluble metal salts, other additives, and at least one nonionic surfactant terminated with a ketone group, have been developed. The use of ketone (e.g., --OCH.sub.2 COCH.sub.3) terminated polyoxyalkylene surfactants results in electrodeposition solutions with reduced foam, and the tin and tin alloy electrodeposits from such plating baths are of superior quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.