TECHNIC, INC.
51Patents
2Active
51Granted
36Portfolio score
Filing activity: Mar 1, 1976 → Dec 18, 2014 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6251238A | Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance | Emerging Cross-Sectional Technologies | 53 | Expired |
| US4534843A | Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like | Chemistry; Metallurgy | 52 | Expired |
| US6197182A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 51 | Expired |
| US4585539A | Electrolytic reactor | Chemistry; Metallurgy | 45 | Expired |
| US4049508A | Tin-nickel plating | Chemistry; Metallurgy | 22 | Expired |
| US4246077A | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds | Chemistry; Metallurgy | 22 | Expired |
| US5755954A | Method of monitoring constituents in electroless plating baths | Physics | 20 | Expired |
| US6183619A | Metal alloy sulfonic acid electroplating baths | Chemistry; Metallurgy | 19 | Expired |
| US7270733B2 | Method and apparatus for real time monitoring of industrial electrolytes | Chemistry; Metallurgy | 19 | Expired |
| US6860981B2 | Minimizing whisker growth in tin electrodeposits | Chemistry; Metallurgy | 19 | Expired |
| US4673472A | Method and electroplating solution for deposition of palladium or alloys thereof | Chemistry; Metallurgy | 16 | Expired |
| US6524463B2 | Method of processing wafers and other planar articles within a processing cell | Electricity | 14 | Expired |
| US6132583A | Shielding method and apparatus for use in electroplating process | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5110423A | Bath for electroplating bright tin or tin-lead alloys and method thereof | Chemistry; Metallurgy | 14 | Expired |
| US4126524A | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys | Chemistry; Metallurgy | 13 | Expired |
| US4406755A | Bright palladium electrodeposition | Chemistry; Metallurgy | 12 | Expired |
| US4278514A | Bright palladium electrodeposition solution | Chemistry; Metallurgy | 12 | Expired |
| US5130168A | Electroless gold plating bath and method of using same | Chemistry; Metallurgy | 12 | Expired |
| US4981564A | Additives for electroplating compositions and methods for their use | Electricity | 11 | Expired |
| US4508611A | Apparatus for electroplating and chemically treating the contact elements of encapsulated electronic components and like devices | Chemistry; Metallurgy | 10 | Expired |
| US6299751A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5277790A | Non-cyanide electroplating solution for gold or alloys thereof | Chemistry; Metallurgy | 10 | Expired |
| US5296128A | Gallic acid as a combination antioxidant, grain refiner, selective precipitant, and selective coordination ligand, in plating formulations | Chemistry; Metallurgy | 10 | Expired |
| US7270734B1 | Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating | Chemistry; Metallurgy | 10 | Expired |
| US5338343A | Catalytic electroless gold plating baths | Chemistry; Metallurgy | 9 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.