Method of manufacturing interconnect bumps
US5283948A · kind A · utility
4Cited by
11References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1991 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | May 31, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a height substantially greater than prior art bumps, while remaining structurally intact. The interconnect bumps are formed using standard photolithography techniques to form the bumps in multiple interlocking portions to achieve a structurally superior interconnect bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.