Patent · US Expired

Porous metal block for removing solder or braze from a substate and a process for making the same

US5284286A · kind A · utility

25Cited by
10References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 31, 1991
Grant dateFeb 8, 1994
Priority date
Expiry dateOct 31, 2011

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB22F2999/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.