Peter J. Brofman
35Patents
15h-index
75Co-inventors
84Inventor score
Filing activity: Oct 31, 1991 → Oct 28, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6258625A | Method of interconnecting electronic components using a plurality of conductive studs | Electricity | 201 | Expired |
| US6270363A | Z-axis compressible polymer with fine metal matrix suspension | Electricity | 78 | Expired |
| US6878608B2 | Method of manufacture of silicon based package | Electricity | 38 | Expired |
| US6283359A | Method for enhancing fatigue life of ball grid arrays | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5968670A | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6158644A | Method for enhancing fatigue life of ball grid arrays | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6184062A | Process for forming cone shaped solder for chip interconnection | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5964396A | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5284286A | Porous metal block for removing solder or braze from a substate and a process for making the same | Performing Operations; Transporting | 25 | Expired |
| US5831810A | Electronic component package with decoupling capacitors completely within die receiving cavity of substrate | Electricity | 24 | Expired |
| US5975409A | Ceramic ball grid array using in-situ solder stretch | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6220499A | Method for assembling a chip carrier to a semiconductor device | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5219520A | Process of making a porous metal block for removing solder or braze | Performing Operations; Transporting | 19 | Expired |
| US6559527B2 | Process for forming cone shaped solder for chip interconnection | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6253986A | Solder disc connection | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6278184A | Solder disc connection | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7709951B2 | Thermal pillow | Electricity | 15 | Active |
| US5868304A | Socketable bump grid array shaped-solder on copper spheres | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7733655B2 | Lid edge capping load | Emerging Cross-Sectional Technologies | 9 | Active |
| US8870051B2 | Flip chip assembly apparatus employing a warpage-suppressor assembly | Electricity | 9 | Active |
| US6070321A | Solder disc connection | Emerging Cross-Sectional Technologies | 9 | Expired |
| US9698072B2 | Low-stress dual underfill packaging | Electricity | 7 | Active |
| US6984792B2 | Dielectric interposer for chip to substrate soldering | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6218629A | Module with metal-ion matrix induced dendrites for interconnection | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7875502B2 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.