Process for producing micro-mechanical structures
US5286341A · kind A · utility
2Cited by
6References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 14, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Oct 14, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0042
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for producing micro-mechanical structures for sensors or actuators is proposed. Here, local oxidations are placed into the surfaces of at least two wafers with the aid of masking technology, so that level wafer surfaces are generated. The at least two wafers are subsequently connected with each other in such a way that the local oxidations of the at least two wafers are in direct contact. The actual sensor structure, which might possibly be mechanically deformable, is exposed by dissolving the local oxidations out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.