Process for the manufacture of printed circuits using electrophoretically deposited organic resists
US5288377A · kind A · utility
20Cited by
20References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1993 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Jan 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Copper surfaces upon which organic resins are electrophoretically deposited to serve as plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.