Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
US5288542A · kind A · utility
26Cited by
22References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Jul 14, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.