Patrick Robert Zippetelli
6Patents
5h-index
12Co-inventors
52Inventor score
Filing activity: Jul 14, 1992 → Aug 5, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5953214A | Dual substrate package assembly coupled to a conducting member | Electricity | 83 | Expired |
| US5288542A | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6046911A | Dual substrate package assembly having dielectric member engaging contacts at only three locations | Electricity | 21 | Expired |
| US5378306A | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6226187A | Integrated circuit package | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6084299A | Integrated circuit package including a heat sink and an adhesive | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.