Notch beveling on semiconductor wafer edges
US5289661A · kind A · utility
17Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1992 |
| Grant date | Mar 1, 1994 |
| Priority date | — |
| Expiry date | Dec 23, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method of contouring the edge of a semiconductor wafer in a fiduciary mark notch utilizes a contouring wheel or burr having a smaller diameter than the diameter of the fiduciary mark notch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.