Patent · US Expired

Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith

US5292477A · kind A · utility

13Cited by
20References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 22, 1992
Grant dateMar 8, 1994
Priority date
Expiry dateOct 22, 2012

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/09701
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Methods of fabricating powders of electrically conductive particles supersaturated with grain growth control additives are described. A molten admixture of an electrically conductive material and a grain growth control additive is atomized by spraying an inert atmosphere forming fine molten particles which rapidly cool to form solid particles which are supersaturated with the grain growth control additive. The supersaturated particles are heated to form an electrical conductor having grain sizes less than about 25 microns. The supersaturated particles can be combined with a binder to form an electrical conductor forming paste. Patterns of the paste can be embedded in a green ceramic which can be sintered to form a semiconductor chip packaging substrate having electrical conductors with controlled grain size. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free and crack free via filled with metal having a fine grain morphology.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.