Lead frame having an outlet with a larger cross sectional area than the inlet
US5293065A · kind A · utility
13Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 27, 1992 |
| Grant date | Mar 8, 1994 |
| Priority date | — |
| Expiry date | Aug 27, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame (10) is connected to an integrated circuit (32) by adhesives. The lead frame (10) includes a mold gate (40) to provide for constant flow of resin (72) into the mold cavity (66) during encapsulation of the integrated circuit (32). The lead frame (10) also has an air vent (50) to direct air and any excess resin (74) from the mold cavity (66) to a dummy cavity (70).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.