Min Yu Chan
17Patents
14h-index
21Co-inventors
78Inventor score
Filing activity: Aug 27, 1992 → Jan 28, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6137164A | Thin stacked integrated circuit device | Electricity | 209 | Expired |
| US5952611A | Flexible pin location integrated circuit package | Electricity | 182 | Expired |
| US5461255A | Multi-layered lead frame assembly for integrated circuits | Electricity | 110 | Expired |
| US6882021B2 | Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead | Electricity | 80 | Expired |
| US6049129A | Chip size integrated circuit package | Electricity | 65 | Expired |
| US6218202A | Semiconductor device testing and burn-in methodology | Electricity | 58 | Expired |
| US6365833B1 | Integrated circuit package | Electricity | 43 | Expired |
| US6177723A | Integrated circuit package and flat plate molding process for integrated circuit package | Electricity | 38 | Expired |
| US6468831B2 | Method of fabricating thin integrated circuit units | Electricity | 33 | Expired |
| US6387729B2 | Method for adhering and sealing a silicon chip in an integrated circuit package | Electricity | 29 | Expired |
| US6087203A | Method for adhering and sealing a silicon chip in an integrated circuit package | Electricity | 29 | Expired |
| US6274929A | Stacked double sided integrated circuit package | Electricity | 22 | Expired |
| US6236107A | Encapsulate resin LOC package and method of fabrication | Electricity | 18 | Expired |
| US5647124A | Method of attachment of a semiconductor slotted lead to a substrate | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5293065A | Lead frame having an outlet with a larger cross sectional area than the inlet | Electricity | 13 | Expired |
| US6040623A | Slotted lead for a semiconductor device | Emerging Cross-Sectional Technologies | 6 | Expired |
| US9418872B2 | Packaged microelectronic components | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.