Apparatus for indirect impingement cooling of integrated circuit chips

US5294830A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Steven P. Young · Boulder, US
• John Acocella · Hopewell Junction, US
• Albert Joseph Fahey · Pasadena, US
• Gaetano P. Messina · Hopewell Junction, US
• Seaho Song · Gatineau, CA

Key dates

• Filing date: May 21, 1991
• Grant date: Mar 15, 1994
• Expiry date: May 21, 2011

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15312
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.