Semiconductor device
US5295044A · kind A · utility
75Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1992 |
| Grant date | Mar 15, 1994 |
| Priority date | — |
| Expiry date | Sep 25, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of circuit boards are used and frames are attached to the circuit boards to surround the peripheral portions thereof. Since connection terminals electrically connected to the respective circuit boards are attached to the respective frames, a semiconductor device having semiconductor elements mounted at high density can be formed by stacking the first and second frames on each other and setting the respective connection terminals in contact with each other to electrically connect the circuit boards to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.