Method of producing semiconductor memory
US5295297A · kind A · utility
38Cited by
10References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1992 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Jul 20, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.