Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive

US5296330A · kind A · utility

Assignees

• Ciba-Geigy · US
• OCG Microelectronics, Inc. · US

Inventors

• Reinhard Schulz · Hannover, DE
• Norbert Munzel · Heitersheim, DE
• Martin Roth · Hölstein, CH
• Wilhelm Knobloch · Bad Schandau, DE

Key dates

• Filing date: Aug 15, 1992
• Grant date: Mar 22, 1994
• Expiry date: Aug 15, 2012

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/0226
• WIPO field: Organic fine chemistry
• WIPO sector: Chemistry

Abstract

Positive photoresist compositions comprising, in an organic solvent, at least PA1 a) one alkali-soluble resin, PA1 b) one photosensitive quinone diazide, PA1 c) one aromatic hydroxy compound of formula I ##STR1## wherein each R is --H, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, --OCH.sub.2 C.sub.6 H.sub.5, --OC.sub.6 H.sub.5 or --COOC.sub.1 -C.sub.4 alkyl, and R.sub.1 and R.sub.2 are each independently of the other H, C.sub.1 -C.sub.4 alkyl, --C.sub.6 H.sub.5 or a cycloaliphatic 5- or 6-membered ring, a is an integer from 0 to 4, and m and n are each independently of the other 0, 1 or 2, which compound enhances the photosensitivity and/or the rate of development, and optionally PA1 d) additional customary modifiers, are eminently suitable for making relief structures.