Radiation-curable composition useful for preparation of solder masks
US5296334A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1992 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Aug 28, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0793
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photosensitive composition for providing a solder mask on a printed circuit board is described, comprised of (a) an esterified styrene-maleic anhydride copolymer having less than 15%, most preferably less than 5%, free anhydride, with at least about 50% of the available anhydride groups being esterified with a hydroxyalkyl (meth)acrylate and at least about 0.1% of the available anhydride groups being esterified with a monohydric alcohol; (b) a multifunctional (meth)acrylate monomer; and (c) a multifunctional epoxide. The composition is coated on a printed circuit board, imagewise exposed to radiation to effect sufficient curing of the composition at exposed areas to enable removal of unexposed areas with developer, and post-baked after development to produce a desired patterned distribution of the cured composition to serve as a solder mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.