Method and apparatus for a semiconductor device having a radiation part
US5296740A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1992 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Mar 13, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a stage having top and bottom surfaces, a semiconductor element which is mounted on the top surface of the stage, a package part which is made of a first resin and encapsulates the semiconductor element so that a surface of the package part and the bottom surface of the stage lie on substantially the same plane, and a radiation part which is made of a second resin and is provided directly on the bottom surface of the stage and the surface of the package part. The second resin includes a filler material selected from a group consisting of metal powders and insulator powders so that a thermal conduction of the second resin is greater than that of the first resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.