Method for removing composite attached to material by dry etching
US5298112A · kind A · utility
59Cited by
3References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Dec 15, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/427
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for removing a composite attached to a material to be treated by dry ashing using a gas including a halogen element and a gas including a hydrogen element or using a gas including fluorine, a gas including oxygen and a gas including chlorine in a reaction chamber containing the material therein for use in manufacturing a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.