Etching of copper-containing devices
US5298117A · kind A · utility
16Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1993 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Jul 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/388
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.