SOI lateral bipolar transistor with edge-strapped base contact and method of fabricating same
US5298786A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1993 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Jul 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/01
Abstract
A silicon-on-insulator lateral bipolar transistor having an edge-strapped base contact is disclosed. A thin layer of oxide is deposited on a silicon-on-insulator structure and a layer of polysilicon is deposited on the thin oxide layer that is patterned and etched to form an extrinsic base region of the transistor. The polysilicon extrinsic base is very heavily doped and the thin oxide layer acts as both a diffusion stop and an etch stop during the formation of the extrinsic base. A silicon edge contact region is formed of selective epitaxy or polysilicon to connect the extrinsic base to the intrinsic base formed in the silicon-on-insulator layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.