Plastic sealed type semiconductor apparatus
US5299092A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | May 22, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic sealed type semiconductor apparatus includes at least two semiconductor devices which are disposed with a space therebetween in such a manner that circuit forming surfaces oppose each other, and an electric signal lead which is adhered to each of the circuit forming surfaces with an insulating member provided therebetween for electric insulation and which is electrically connected to the semiconductor device by a thin metal wire. The semiconductor devices and the electric signal leads are sealed with a resin in a state where the electric signal leads are laid on top of one another to form a plastic package. The overlaid portion of the electric signal leads has a surface contact portion of the leads and a resin providing portion. The resin providing portion is a recessed portion which is formed when the resin is molded in such a manner that it passes through the surface contact portion of the leads in the lateral direction thereof. The resin providing portion prevents entry of water or moisture and thus eliminates corrosion or breakage of the electric interconnections formed on the circuit forming surface of the semiconductor device or thin metal wires. Thus, the reliabili…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.